The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending...

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Principais autores: Curtulo, Joanisa P., Dias, Marcelino, Bertelli, Felipe, Silva, Bismarck Luiz, Spinelli, José Eduardo, Garcia, Amauri, Cheung, Noé
Formato: article
Idioma:English
Publicado em: Elsevier
Assuntos:
Sn-Sb alloy
Peritectic
Heat transfer
Analytical model
Solidification
Wettability
Interface
Endereço do item:https://repositorio.ufrn.br/handle/123456789/32177
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spelling ri-123456789-321772024-03-19T04:04:22Z The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates Curtulo, Joanisa P. Dias, Marcelino Bertelli, Felipe Silva, Bismarck Luiz Spinelli, José Eduardo Garcia, Amauri Cheung, Noé Sn-Sb alloy Peritectic Heat transfer Analytical model Solidification Wettability Interface Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending very different conditions. A straightforward view of the mechanisms affecting the heat transfer efficiencies was consistent with a number of techniques applied in the present investigation, which includes directional solidification experiments, analytical modelling, wettability analyses and characterization of the reactions between the alloy and the substrates. The proposed analytical model was perceptive to these reactions. For the Cu substrate, the motion of Cu towards the alloy was more effective as compared to the motion of Ni from the Ni substrate. As a consequence, the alloy/Cu interface presented a higher level of Kirkendall voids. The higher fraction of voids at the interface resulted in lower interfacial thermal conductance for the Sn-Sb/Cu couple. Hence, the present experimental-theoretical approach is useful to indicate the solder joint integrity in terms of the presence of empty spots. Despite the higher thermal conductivity of Cu and lower contact angle between the alloy and the Cu in comparison to the Ni substrate, the high porosity at the Cu interface during alloy soldering was shown to reduce the heat transfer capability 2021-01 2021-04-12T20:43:47Z 2019-12 article CURTULO, Joanisa P.; DIAS, Marcelino; BERTELLI, Felipe; SILVA, Bismarck L.; SPINELLI, José E.; GARCIA, Amauri; CHEUNG, Noé. The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates. Journal of Manufacturing Processes, [S.L.], v. 48, p. 164-173, dez. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1526612519303706?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jmapro.2019.10.029 1526-6125 https://repositorio.ufrn.br/handle/123456789/32177 10.1016/j.jmapro.2019.10.029 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ application/pdf Elsevier
institution Repositório Institucional
collection RI - UFRN
language English
topic Sn-Sb alloy
Peritectic
Heat transfer
Analytical model
Solidification
Wettability
Interface
spellingShingle Sn-Sb alloy
Peritectic
Heat transfer
Analytical model
Solidification
Wettability
Interface
Curtulo, Joanisa P.
Dias, Marcelino
Bertelli, Felipe
Silva, Bismarck Luiz
Spinelli, José Eduardo
Garcia, Amauri
Cheung, Noé
The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
description Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending very different conditions. A straightforward view of the mechanisms affecting the heat transfer efficiencies was consistent with a number of techniques applied in the present investigation, which includes directional solidification experiments, analytical modelling, wettability analyses and characterization of the reactions between the alloy and the substrates. The proposed analytical model was perceptive to these reactions. For the Cu substrate, the motion of Cu towards the alloy was more effective as compared to the motion of Ni from the Ni substrate. As a consequence, the alloy/Cu interface presented a higher level of Kirkendall voids. The higher fraction of voids at the interface resulted in lower interfacial thermal conductance for the Sn-Sb/Cu couple. Hence, the present experimental-theoretical approach is useful to indicate the solder joint integrity in terms of the presence of empty spots. Despite the higher thermal conductivity of Cu and lower contact angle between the alloy and the Cu in comparison to the Ni substrate, the high porosity at the Cu interface during alloy soldering was shown to reduce the heat transfer capability
format article
author Curtulo, Joanisa P.
Dias, Marcelino
Bertelli, Felipe
Silva, Bismarck Luiz
Spinelli, José Eduardo
Garcia, Amauri
Cheung, Noé
author_facet Curtulo, Joanisa P.
Dias, Marcelino
Bertelli, Felipe
Silva, Bismarck Luiz
Spinelli, José Eduardo
Garcia, Amauri
Cheung, Noé
author_sort Curtulo, Joanisa P.
title The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_short The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_full The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_fullStr The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_full_unstemmed The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
title_sort application of an analytical model to solve an inverse heat conduction problem: transient solidification of a sn-sb peritectic solder alloy on distinct substrates
publisher Elsevier
publishDate 2021
url https://repositorio.ufrn.br/handle/123456789/32177
work_keys_str_mv AT curtulojoanisap theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT diasmarcelino theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT bertellifelipe theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT silvabismarckluiz theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT spinellijoseeduardo theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT garciaamauri theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT cheungnoe theapplicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT curtulojoanisap applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT diasmarcelino applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT bertellifelipe applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT silvabismarckluiz applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT spinellijoseeduardo applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT garciaamauri applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
AT cheungnoe applicationofananalyticalmodeltosolveaninverseheatconductionproblemtransientsolidificationofasnsbperitecticsolderalloyondistinctsubstrates
_version_ 1797696578552594432

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