The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
Three distinct alloy/substrate couples were considered. In order to treat the reaction interface problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low carbon steel were chosen so that solidification of a Sn-Sb peritectic alloy could be evaluated comprehending...
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| Principais autores: | , , , , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Elsevier
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| Assuntos: | |
| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/32177 |
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