Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels
The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling...
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| Principais autores: | , , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
SAGE Publications
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31788 |
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