Transient unidirectional solidification, microstructure and intermetallics in Sn-Ni Alloys

The present research work examines the microstructural arrangements formed during the transient solidification of eutectic Sn-0.2wt.%Ni and hypereutectic Sn-0.5wt.%Ni alloys. Also, it examines their respective correlations with solidification thermal parameters: eutectic growth rate (VE) and eutecti...

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Detalhes bibliográficos
Principais autores: Cruz, Clarissa Barros da, Kakitani, Rafael, Xavier, Marcella Gautê Cavalcante, Silva, Bismarck Luiz, Garcia, Amauri, Cheung, Noé, Spinelli, José Eduardo
Formato: article
Idioma:English
Publicado em: ABM, ABC, ABPol
Assuntos:
Lead-free alloys
Transient solidification
Microstructure
Intermetallics
Tensile properties
Wettability
Endereço do item:https://repositorio.ufrn.br/handle/123456789/31742
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https://repositorio.ufrn.br/handle/123456789/31742

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