Tailoring morphology and size of microstructure and tensile properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) solder alloys
Transient directional solidification experiments, and further optical and scanning electron microscopy analyses and tensile tests, allowed the dependence of tensile properties on the micromorphology and length scale of the dendritic/cellular matrix of ternary Sn-5.5Sb-1Ag and Sn-5.5Sb-1Cu alloys to...
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| Principais autores: | , , , , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Springer
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| Assuntos: | |
| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31738 |
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