Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples
Directional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms...
Na minha lista:
| Principais autores: | , , , , , , |
|---|---|
| Formato: | article |
| Idioma: | English |
| Publicado em: |
Springer
|
| Assuntos: | |
| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31678 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|