Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys
Rapidly solidified Sn-based solder alloys can provide metallurgical features such as low segregation and fine intermetallic compounds (IMCs). These features can be obtained in a controlled way by Impulse Atomization that provides powders of various sizes corresponding to a variety of cooling rates a...
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| Principais autores: | , , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Elsevier
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31886 |
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