Correlation between microstructure and hardness of a Bi-1.5wt%Ag lead-free solder alloy
In the present study a hypoeutectic Bi-1.5wt%Ag alloy was directionally solidified under transient heat flow conditions and the microstructure was analysed. Bi-Ag alloys are considered as potential alternatives to replace Pb-based alloys as solder materials for metallic connections under high temper...
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| Principais autores: | , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
IOP Publishing
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31885 |
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