Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantag...

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Principais autores: Silva, Bismarck Luiz, Garcia, Amauri, Spinelli, José Eduardo
Formato: article
Idioma:English
Publicado em: Elsevier
Assuntos:
Sn–Bi–Cu alloys
Sn–Bi–Ag alloys
Solder alloys
Solidification
Cooling rate
Microstructure
Endereço do item:https://repositorio.ufrn.br/handle/123456789/31884
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spelling ri-123456789-318842021-03-21T08:47:17Z Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys Silva, Bismarck Luiz Garcia, Amauri Spinelli, José Eduardo Sn–Bi–Cu alloys Sn–Bi–Ag alloys Solder alloys Solidification Cooling rate Microstructure Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined 2021-03-15T20:38:50Z 2021-03-15T20:38:50Z 2016-04 article SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys. Materials Characterization, [S.L.], v. 114, p. 30-42, abr. 2016. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580316300274?via%3Dihub. Acesso em: 27 jan. 2021. http://dx.doi.org/10.1016/j.matchar.2016.02.002 1044-5803 https://repositorio.ufrn.br/handle/123456789/31884 10.1016/j.matchar.2016.02.002 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ application/pdf Elsevier
institution Repositório Institucional
collection RI - UFRN
language English
topic Sn–Bi–Cu alloys
Sn–Bi–Ag alloys
Solder alloys
Solidification
Cooling rate
Microstructure
spellingShingle Sn–Bi–Cu alloys
Sn–Bi–Ag alloys
Solder alloys
Solidification
Cooling rate
Microstructure
Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
description Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi–Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn–Bi–(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn–Bi–(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the microstructural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn–Bi–Cu and Sn–Bi–Ag alloys examined
format article
author Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
author_facet Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
author_sort Silva, Bismarck Luiz
title Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
title_short Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
title_full Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
title_fullStr Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
title_full_unstemmed Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
title_sort cooling thermal parameters and microstructure features of directionally solidified ternary sn–bi–(cu,ag) solder alloys
publisher Elsevier
publishDate 2021
url https://repositorio.ufrn.br/handle/123456789/31884
work_keys_str_mv AT silvabismarckluiz coolingthermalparametersandmicrostructurefeaturesofdirectionallysolidifiedternarysnbicuagsolderalloys
AT garciaamauri coolingthermalparametersandmicrostructurefeaturesofdirectionallysolidifiedternarysnbicuagsolderalloys
AT spinellijoseeduardo coolingthermalparametersandmicrostructurefeaturesofdirectionallysolidifiedternarysnbicuagsolderalloys
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