Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys
Low temperature soldering technology encompasses Sn–Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 °C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantag...
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| Principais autores: | , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Elsevier
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31884 |
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