High cooling rate, regular and plate like cells in Sn–Ni solder alloys
Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite tran...
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| Principais autores: | , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Wiley
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31787 |
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