Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy
The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experim...
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| Principais autores: | , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
ABM, ABC, ABPol
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31739 |
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