Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate

Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigate...

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Principais autores:	Silva, Bismarck Luiz, Garcia, Amauri, Spinelli, José Eduardo
Formato:	article
Idioma:	English
Publicado em:	Elsevier
Assuntos:	Solder alloys Solidification Wettability Thermal analysis
Endereço do item:	https://repositorio.ufrn.br/handle/123456789/31679
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id	ri-123456789-31679
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spelling	ri-123456789-316792021-03-07T08:48:51Z Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate Silva, Bismarck Luiz Garcia, Amauri Spinelli, José Eduardo Solder alloys Solidification Wettability Thermal analysis Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are compared 2021-03-04T15:06:03Z 2021-03-04T15:06:03Z 2019 article Silva, B.L.; Garcia, A. ; SPINELLI, J. E. . Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. Journal of Materials Research and Technology-JMR&T, v. 8, p. 1581-1586, 2019. Disponível em: https://www.sciencedirect.com/science/article/pii/S2238785418302254?via%3Dihub. Acesso em: 21 jan. 2021. https://doi.org/10.1016/j.jmrt.2018.06.016 2238-7854 https://repositorio.ufrn.br/handle/123456789/31679 10.1016/j.jmrt.2018.06.016 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ application/pdf Elsevier
institution	Repositório Institucional
collection	RI - UFRN
language	English
topic	Solder alloys Solidification Wettability Thermal analysis
spellingShingle	Solder alloys Solidification Wettability Thermal analysis Silva, Bismarck Luiz Garcia, Amauri Spinelli, José Eduardo Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
description	Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn–34Bi and the Sn–34Bi–0.1Cu alloys are compared
format	article
author	Silva, Bismarck Luiz Garcia, Amauri Spinelli, José Eduardo
author_facet	Silva, Bismarck Luiz Garcia, Amauri Spinelli, José Eduardo
author_sort	Silva, Bismarck Luiz
title	Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_short	Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_full	Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_fullStr	Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_full_unstemmed	Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
title_sort	wetting behavior of sn–ag–cu and sn–bi–x alloys: insights into factors affecting cooling rate
publisher	Elsevier
publishDate	2021
url	https://repositorio.ufrn.br/handle/123456789/31679
work_keys_str_mv	AT silvabismarckluiz wettingbehaviorofsnagcuandsnbixalloysinsightsintofactorsaffectingcoolingrate AT garciaamauri wettingbehaviorofsnagcuandsnbixalloysinsightsintofactorsaffectingcoolingrate AT spinellijoseeduardo wettingbehaviorofsnagcuandsnbixalloysinsightsintofactorsaffectingcoolingrate
_version_	1773963865950781440

Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate

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