Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn–0.7Cu–(1; 2 and 3Ag) and four Sn–34Bi–(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigate...
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| Principais autores: | , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Elsevier
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| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31679 |
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