A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys

Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the developm...

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Principais autores: Dias, Marcelino, Costa, Thiago Antônio, Silva, Bismarck Luiz, Spinelli, José Eduardo, Cheunga, Noé, Garcia, Amauri
Formato: article
Idioma:English
Publicado em: Elsevier
Assuntos:
Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
Endereço do item:https://repositorio.ufrn.br/handle/123456789/32178
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spelling ri-123456789-321782021-04-18T09:05:42Z A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys Dias, Marcelino Costa, Thiago Antônio Silva, Bismarck Luiz Spinelli, José Eduardo Cheunga, Noé Garcia, Amauri Solder alloys Sn-Sb alloys Microstructure Tensile properties Wettability Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability 2021-04-12T20:47:48Z 2021-04-12T20:47:48Z 2018-02 article DIAS, Marcelino; COSTA, Thiago A.; SILVA, Bismarck L.; SPINELLI, José E.; CHEUNG, Noé; GARCIA, Amauri. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. Microelectronics Reliability, [S.L.], v. 81, p. 150-158, fev. 2018. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0026271417305875?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.microrel.2017.12.029 0026-2714 https://repositorio.ufrn.br/handle/123456789/32178 10.1016/j.microrel.2017.12.029 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ application/pdf Elsevier
institution Repositório Institucional
collection RI - UFRN
language English
topic Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
spellingShingle Solder alloys
Sn-Sb alloys
Microstructure
Tensile properties
Wettability
Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
description Sn-Sb alloys are among the current alternatives for the development of alloys for high-temperature lead-free solders. The Sn-Sb alloys having 5.5 wt.% Sb or less are known to have good mechanical properties, and despite the quite low liquidus temperature have been considered adequate in the development of solder joints. The increase in the Sb content up to the limit of solubility in Sn at about 10 wt.% is supposed to be detrimental to the mechanical properties due to the extensive formation of an intermetallic compound. Investigations on the interrelation of microstructure of this alloy and the corresponding mechanical properties are fundamental to an appropriate evaluation of its application in solder joints. The present investigation analyses the relationship between microstructural features of the peritectic Sn-10 wt.% Sb alloy, solidified under a wide range of cooling rates, and the resulting mechanical properties. A cellular β-Sn matrix, typified by cellular spacings that decrease with the increase in the solidification cooling rate, and Sn3Sb2 particles are shown to characterize the alloy microstructure. The ultimate tensile strength is higher as compared with the corresponding values of the hypoperitectic Sn-5.5 wt.% Sb solder alloy, however the elongation is shown to decrease. A comparison with Bi-Ag alloys, considered good high temperature solders alternatives, has shown that the tensile properties of the Sn-10 wt.% Sb alloy, including elongation, are significantly higher. Wettability tests have been carried out and the experimental results, according to reports from the literature, are associated with good wettability
format article
author Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
author_facet Dias, Marcelino
Costa, Thiago Antônio
Silva, Bismarck Luiz
Spinelli, José Eduardo
Cheunga, Noé
Garcia, Amauri
author_sort Dias, Marcelino
title A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_short A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_full A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_fullStr A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_full_unstemmed A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
title_sort comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic sn-sb solder alloys
publisher Elsevier
publishDate 2021
url https://repositorio.ufrn.br/handle/123456789/32178
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