Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys...

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Principais autores:	Schon, Aline Ferreira, Reyes, Rodrigo Valenzuela, Spinelli, José Eduardo, Garcia, Amauri, Silva, Bismarck Luiz
Formato:	article
Idioma:	English
Publicado em:	Elsevier
Assuntos:	Sn-Sb alloy Solders Solidification Microstructure Tensile behavior
Endereço do item:	https://repositorio.ufrn.br/handle/123456789/32176
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spelling	ri-123456789-321762024-03-19T04:02:29Z Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate Schon, Aline Ferreira Reyes, Rodrigo Valenzuela Spinelli, José Eduardo Garcia, Amauri Silva, Bismarck Luiz Sn-Sb alloy Solders Solidification Microstructure Tensile behavior In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys (containing 85 to 97 wt% of Pb) given that lead (Pb) is considered an important environmental complaint and has devastating effects on the human body. The imposed conditions in the present experiment may lead to solutal and thermal stability of the melt throughout solid growth towards the liquid. It was found that Sn-rich cells may prevail for cooling rates higher than 1.0 K/s whereas only Sn-rich dendrites appear for specimens solidified at rates lower than 0.3 K/s. The growth of dendrites is delayed when compared to previous results in the literature. In the presence of convective flow originated either thermally or solutally, β-Sn dendrites were reported to grow for samples solidified at rates as high as 1.5 K/s (i.e., 5 times higher). It appears that convection currents induce instabilities to happen at the solidification front and the growth of dendrites is benefited over such conditions. Tensile tests were also performed for Sn-Sb samples having distinct cellular and dendritic dimensions. It was found that unstable plastic flow happened during all tensile tests. The formation of bands along a specimen gauge was recognized as being a manifestation of the Portevin – Le Chatelier (PLC) effect. A homogeneous deformation stage preceded the start of serrations of stresses in the samples of the investigated alloy. The amplitudes of the serrations were found to be lower in the samples having cells as compared to those associated with dendritic microstructures 2021-12 2021-04-12T20:40:33Z 2019-11-15 article SCHON, Aline Ferreira; REYES, Rodrigo Valenzuela; SPINELLI, José Eduardo; GARCIA, Amauri; SILVA, Bismarck Luiz. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal Of Alloys And Compounds, [S.L.], v. 809, p. 151780-151780, nov. 2019. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S0925838819330130?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.jallcom.2019.151780 0925-8388 https://repositorio.ufrn.br/handle/123456789/32176 10.1016/j.jallcom.2019.151780 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ application/pdf Elsevier
institution	Repositório Institucional
collection	RI - UFRN
language	English
topic	Sn-Sb alloy Solders Solidification Microstructure Tensile behavior
spellingShingle	Sn-Sb alloy Solders Solidification Microstructure Tensile behavior Schon, Aline Ferreira Reyes, Rodrigo Valenzuela Spinelli, José Eduardo Garcia, Amauri Silva, Bismarck Luiz Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
description	In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys (containing 85 to 97 wt% of Pb) given that lead (Pb) is considered an important environmental complaint and has devastating effects on the human body. The imposed conditions in the present experiment may lead to solutal and thermal stability of the melt throughout solid growth towards the liquid. It was found that Sn-rich cells may prevail for cooling rates higher than 1.0 K/s whereas only Sn-rich dendrites appear for specimens solidified at rates lower than 0.3 K/s. The growth of dendrites is delayed when compared to previous results in the literature. In the presence of convective flow originated either thermally or solutally, β-Sn dendrites were reported to grow for samples solidified at rates as high as 1.5 K/s (i.e., 5 times higher). It appears that convection currents induce instabilities to happen at the solidification front and the growth of dendrites is benefited over such conditions. Tensile tests were also performed for Sn-Sb samples having distinct cellular and dendritic dimensions. It was found that unstable plastic flow happened during all tensile tests. The formation of bands along a specimen gauge was recognized as being a manifestation of the Portevin – Le Chatelier (PLC) effect. A homogeneous deformation stage preceded the start of serrations of stresses in the samples of the investigated alloy. The amplitudes of the serrations were found to be lower in the samples having cells as compared to those associated with dendritic microstructures
format	article
author	Schon, Aline Ferreira Reyes, Rodrigo Valenzuela Spinelli, José Eduardo Garcia, Amauri Silva, Bismarck Luiz
author_facet	Schon, Aline Ferreira Reyes, Rodrigo Valenzuela Spinelli, José Eduardo Garcia, Amauri Silva, Bismarck Luiz
author_sort	Schon, Aline Ferreira
title	Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_short	Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_full	Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_fullStr	Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_full_unstemmed	Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
title_sort	assessing microstructure and mechanical behavior changes in a sn-sb solder alloy induced by cooling rate
publisher	Elsevier
publishDate	2021
url	https://repositorio.ufrn.br/handle/123456789/32176
work_keys_str_mv	AT schonalineferreira assessingmicrostructureandmechanicalbehaviorchangesinasnsbsolderalloyinducedbycoolingrate AT reyesrodrigovalenzuela assessingmicrostructureandmechanicalbehaviorchangesinasnsbsolderalloyinducedbycoolingrate AT spinellijoseeduardo assessingmicrostructureandmechanicalbehaviorchangesinasnsbsolderalloyinducedbycoolingrate AT garciaamauri assessingmicrostructureandmechanicalbehaviorchangesinasnsbsolderalloyinducedbycoolingrate AT silvabismarckluiz assessingmicrostructureandmechanicalbehaviorchangesinasnsbsolderalloyinducedbycoolingrate
_version_	1797696454099206144

Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate

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