Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate
In the present investigation a directional solidification experiment was performed in order to examine distinct microstructures related to different slices of the solidified Sn-2 wt.%Sb alloy casting. Such alloy is an alternative of interest with the target of replacing lead-containing solder alloys...
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| Principais autores: | , , , , |
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| Formato: | article |
| Idioma: | English |
| Publicado em: |
Elsevier
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| Assuntos: | |
| Endereço do item: | https://repositorio.ufrn.br/handle/123456789/32176 |
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