Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys

Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic devices. In this framework, the...

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Principais autores: Paixão, Jeverton Laureano, Gomes, Leonardo Fernandes, Reyes, Rodrigo Valenzuela, Garcia, Amauri, Spinelli, José Eduardo, Silva, Bismarck Luiz
Formato: article
Idioma:English
Publicado em: Elsevier
Assuntos:
Sn-Bi-Sb alloys
Thermal interface materials
Solidification
Microstructure
Tensile properties
Fracture surface
Endereço do item:https://repositorio.ufrn.br/handle/123456789/32175
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spelling ri-123456789-321752024-03-19T04:03:31Z Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys Paixão, Jeverton Laureano Gomes, Leonardo Fernandes Reyes, Rodrigo Valenzuela Garcia, Amauri Spinelli, José Eduardo Silva, Bismarck Luiz Sn-Bi-Sb alloys Thermal interface materials Solidification Microstructure Tensile properties Fracture surface Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic devices. In this framework, the effects of Antimony (Sb) additions on the microstructure and tensile properties of the Sn-52 wt% Bi alloy are investigated. Various Sn-Bi(-Sb) samples solidified at different cooling rates and two levels of Sb-containing alloys allow a comprehensive examination of length scales of either dendritic or eutectic microstructures. A number of experimental techniques are used here to permit a sound analyses of the ternary Sn-Bi(-Sb) alloys: transient directional solidification, optical microscopy (OM), triangle and intercept quantification methods, scanning electron microscopy (SEM), x-ray fluorescence (XRF), x-ray diffraction (XRD), tensile tests and fractography. The addition of Sb enhances the nucleation of primary dendritic trunks, which resulted in a decrease in the primary dendritic arm spacing (λ1) by about 5 times for the Sn-52 wt% Bi-2 wt% Sb alloy as compared to the results for the binary Sn-Bi alloy. The relationships found for tensile properties as a function of the secondary dendritic arm spacing (λ2) demonstrate that Sb additions increase the alloy strength while preserving the ductility. This is due to very thin SnSb intermetallic particles formed in the Sn-rich dendritic matrix. The influence of λ2 variation on both the yield and ultimate strengths is roughly insignificant while the ductility varies strongly between 14.4% and 52% for samples solidified from 0.05 °C/s to 5.0 °C/s respectively. When 2.0 wt% Sb is added, there is a maintenance in the levels of ductility as those found for the binary Sn-Bi alloy. This occurs especially for very refined dendritic and eutectic microstructures samples, which also exhibit a ductile fracture mode 2022-09 2021-04-12T20:37:53Z 2020-08 article PAIXÃO, Jeverton Laureano; GOMES, Leonardo Fernandes; REYES, Rodrigo Valenzuela; GARCIA, Amauri; SPINELLI, José Eduardo; SILVA, Bismarck Luiz. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. Materials Characterization, [S.L.], v. 166, p. 110445-110445, ago. 2020. Disponível em: https://www.sciencedirect.com/science/article/abs/pii/S1044580320319161?via%3Dihub. Acesso em: 05 mar. 2021. http://dx.doi.org/10.1016/j.matchar.2020.110445 1044-5803 https://repositorio.ufrn.br/handle/123456789/32175 10.1016/j.matchar.2020.110445 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ application/pdf Elsevier
institution Repositório Institucional
collection RI - UFRN
language English
topic Sn-Bi-Sb alloys
Thermal interface materials
Solidification
Microstructure
Tensile properties
Fracture surface
spellingShingle Sn-Bi-Sb alloys
Thermal interface materials
Solidification
Microstructure
Tensile properties
Fracture surface
Paixão, Jeverton Laureano
Gomes, Leonardo Fernandes
Reyes, Rodrigo Valenzuela
Garcia, Amauri
Spinelli, José Eduardo
Silva, Bismarck Luiz
Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
description Sn-Bi-based Thermal Interface Materials (TIM) are adequate alloys to promote heat dissipation in power electronics. However, despite the necessary thermal connection, mechanical support for different components and substrates are of prime importance in microelectronic devices. In this framework, the effects of Antimony (Sb) additions on the microstructure and tensile properties of the Sn-52 wt% Bi alloy are investigated. Various Sn-Bi(-Sb) samples solidified at different cooling rates and two levels of Sb-containing alloys allow a comprehensive examination of length scales of either dendritic or eutectic microstructures. A number of experimental techniques are used here to permit a sound analyses of the ternary Sn-Bi(-Sb) alloys: transient directional solidification, optical microscopy (OM), triangle and intercept quantification methods, scanning electron microscopy (SEM), x-ray fluorescence (XRF), x-ray diffraction (XRD), tensile tests and fractography. The addition of Sb enhances the nucleation of primary dendritic trunks, which resulted in a decrease in the primary dendritic arm spacing (λ1) by about 5 times for the Sn-52 wt% Bi-2 wt% Sb alloy as compared to the results for the binary Sn-Bi alloy. The relationships found for tensile properties as a function of the secondary dendritic arm spacing (λ2) demonstrate that Sb additions increase the alloy strength while preserving the ductility. This is due to very thin SnSb intermetallic particles formed in the Sn-rich dendritic matrix. The influence of λ2 variation on both the yield and ultimate strengths is roughly insignificant while the ductility varies strongly between 14.4% and 52% for samples solidified from 0.05 °C/s to 5.0 °C/s respectively. When 2.0 wt% Sb is added, there is a maintenance in the levels of ductility as those found for the binary Sn-Bi alloy. This occurs especially for very refined dendritic and eutectic microstructures samples, which also exhibit a ductile fracture mode
format article
author Paixão, Jeverton Laureano
Gomes, Leonardo Fernandes
Reyes, Rodrigo Valenzuela
Garcia, Amauri
Spinelli, José Eduardo
Silva, Bismarck Luiz
author_facet Paixão, Jeverton Laureano
Gomes, Leonardo Fernandes
Reyes, Rodrigo Valenzuela
Garcia, Amauri
Spinelli, José Eduardo
Silva, Bismarck Luiz
author_sort Paixão, Jeverton Laureano
title Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
title_short Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
title_full Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
title_fullStr Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
title_full_unstemmed Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys
title_sort microstructure characterization and tensile properties of directionally solidified sn-52 wt% bi-1wt% sb and sn-52wt% bi-2wt% sb alloys
publisher Elsevier
publishDate 2021
url https://repositorio.ufrn.br/handle/123456789/32175
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