An alternative thermal approach to evaluate the wettability of solder alloys
The aim of the work is to propose an alternative method to qualitatively evaluate the wettability of different alloys of a particular alloy system. The technique is based on a thermal approach supported by experimental/theoretical methodologies involving a directional solidification procedure and nu...
Na minha lista:
Principais autores: | Santos, Washington Luis Reis, Silva, Bismarck Luiz, Bertelli, Felipe, Spinelli, José Eduardo, Cheung, Noé, Garcia, Amauri |
---|---|
Formato: | article |
Idioma: | English |
Publicado em: |
Elsevier
|
Assuntos: | |
Endereço do item: | https://repositorio.ufrn.br/handle/123456789/31887 |
Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|
Registros relacionados
-
Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples
por: Lima, Thiago Soares, et al.
Publicado em: (2021) -
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys
por: Silva, Bismarck Luiz, et al.
Publicado em: (2021) -
The application of an analytical model to solve an inverse heat conduction problem: transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
por: Curtulo, Joanisa P., et al.
Publicado em: (2021) -
A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
por: Dias, Marcelino, et al.
Publicado em: (2021) -
The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy
por: Ramos, Lidiane Silva, et al.
Publicado em: (2021)