High cooling rate, regular and plate like cells in Sn–Ni solder alloys

Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite tran...

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Principais autores: Xavier, Marcella G. C., Silva, Bismarck Luiz, Garcia, Amauri, Spinelli, José Eduardo
Formato: article
Idioma:English
Publicado em: Wiley
Assuntos:
Microstructure
Sn–Ni
Tensile properties
Endereço do item:https://repositorio.ufrn.br/handle/123456789/31787
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spelling ri-123456789-317872022-05-25T21:27:47Z High cooling rate, regular and plate like cells in Sn–Ni solder alloys Xavier, Marcella G. C. Silva, Bismarck Luiz Garcia, Amauri Spinelli, José Eduardo Microstructure Sn–Ni Tensile properties Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β‐Sn cells are associated with cooling rates >5.5 and >2.7 K s−1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0002–Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn4 eutectic phase results in higher ductility 2021-03-10T12:07:25Z 2021-03-10T12:07:25Z 2018-03-13 article XAVIER, Marcella G. C.; SILVA, Bismarck L.; GARCIA, Amauri; SPINELLI, José E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. Advanced Engineering Materials, [S.L.], v. 20, n. 7, p. 1701179-1701179, 13 mar. 2018. Disponível em: https://onlinelibrary.wiley.com/doi/abs/10.1002/adem.201701179. Acesso em: 25 jan. 2021. http://dx.doi.org/10.1002/adem.201701179 1438-1656 1527-2648 https://repositorio.ufrn.br/handle/123456789/31787 10.1002/adem.201701179 en Attribution 3.0 Brazil http://creativecommons.org/licenses/by/3.0/br/ Wiley
institution Repositório Institucional
collection RI - UFRN
language English
topic Microstructure
Sn–Ni
Tensile properties
spellingShingle Microstructure
Sn–Ni
Tensile properties
Xavier, Marcella G. C.
Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
High cooling rate, regular and plate like cells in Sn–Ni solder alloys
description Broad ranges of cooling rates (urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0001) 0.8–30.5 and 0.4–5.0 K s−1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β‐Sn cells are associated with cooling rates >5.5 and >2.7 K s−1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘urn:x-wiley:14381656:media:adem201701179:adem201701179-math-0002–Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn4 eutectic phase results in higher ductility
format article
author Xavier, Marcella G. C.
Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
author_facet Xavier, Marcella G. C.
Silva, Bismarck Luiz
Garcia, Amauri
Spinelli, José Eduardo
author_sort Xavier, Marcella G. C.
title High cooling rate, regular and plate like cells in Sn–Ni solder alloys
title_short High cooling rate, regular and plate like cells in Sn–Ni solder alloys
title_full High cooling rate, regular and plate like cells in Sn–Ni solder alloys
title_fullStr High cooling rate, regular and plate like cells in Sn–Ni solder alloys
title_full_unstemmed High cooling rate, regular and plate like cells in Sn–Ni solder alloys
title_sort high cooling rate, regular and plate like cells in sn–ni solder alloys
publisher Wiley
publishDate 2021
url https://repositorio.ufrn.br/handle/123456789/31787
work_keys_str_mv AT xaviermarcellagc highcoolingrateregularandplatelikecellsinsnnisolderalloys
AT silvabismarckluiz highcoolingrateregularandplatelikecellsinsnnisolderalloys
AT garciaamauri highcoolingrateregularandplatelikecellsinsnnisolderalloys
AT spinellijoseeduardo highcoolingrateregularandplatelikecellsinsnnisolderalloys
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