Síntese de compósitos a partir do álcool polivinílico reforçados com resíduos de placas de circuito impresso
The renewal of technologies causes the increase of electronic waste in the environment. The search for methods for the treatment of these wastes generates great discussions at national as well as international level. The printed circuit boards coming from obsolete equipment arouse great interest...
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| Formato: | Dissertação |
| Idioma: | pt_BR |
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| Endereço do item: | https://repositorio.ufrn.br/jspui/handle/123456789/27405 |
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| Resumo: | The renewal of technologies causes the increase of electronic waste in the
environment. The search for methods for the treatment of these wastes generates
great discussions at national as well as international level. The printed circuit boards
coming from obsolete equipment arouse great interest in researches, since they have
several metals in their composition, that can be recovered. However, there are still few
studies that seek to reuse the substrate from the removal of metals. Composite
materials have been widely studied because they provide improvements in the
mechanical, thermal and physicochemical properties of materials for certain
applications. In this work, composites with residues of printed circuit board were
developed, having as its matrix the polyvinyl alcohol. 5%, 10%, and 20% by weight of
plate powder were used to produce the composites, which were submitted to thermal
analysis (TG / DSC). The mechanical properties (wear and friction coefficient) were
determined by mechanical pin-disk test. Surface topography was analyzed by
Scanning Electron Microscopy (SEM). The samples were then subjected to the
flammability test to evaluate the flame behavior and characterized by X-ray
fluorescence and absorption spectroscopy in the infrared region with Fourier transform.
Based on the results of the mechanical test, it was verified that there was no significant
variation in the coefficient of friction and wear of the materials, with PVA 10 and PVA
20 being the composites with the lowest coefficient of friction, 0.071 and 0.086,
respectively. In relation to the thermal analysis, it was verified the reduction of the
thermal stability and the production of large number of residues with the increase of
the load percentage. This growth is due to the presence of silicon compounds and
metals present in the powder of the plaques that qualify the composites as flame
retardants, confirmed by the 23% content of the silicon element at the temperature of
900 ° C after X-ray fluorescence. of flammability, it was possible to observe that the
increase of the mass of the plate of dust causes the increase of the resistance of the
flame propagation in the composites, causing very little damages to the materials. All
the composites showed flame-retardants behavior, the PVA 20 being the most
favorable because it allows a greater reuse of the printed circuit boards. |
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